Invention Grant
- Patent Title: Substrate and method for manufacturing the same
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Application No.: US18068032Application Date: 2022-12-19
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Publication No.: US11990396B2Publication Date: 2024-05-21
- Inventor: Kazuyuki Mitsukura , Masaya Toba , Yoshinori Ejiri , Kazuhiko Kurafuchi
- Applicant: SHOWA DENKO MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: RESONAC CORPORATION
- Current Assignee: RESONAC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: FITCH, EVEN, TABIN & FLANNERY, LLP
- Priority: JP 16061899 2016.03.25
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/12 ; H01L23/14 ; H01L23/32 ; H01L23/538 ; H01L25/065 ; H05K1/09
Abstract:
An organic interposer includes: a first organic insulating layer including a groove; a first metal wire located in the groove; a barrier metal material covering the first metal wire; and a second metal wire located above the first metal wire, wherein the barrier metal material includes: a first barrier metal film interposed between the first metal wire and an inner surface of the groove; and a second barrier metal film located on the first metal wire, and wherein the second metal wire is in contact with both of the first barrier metal film and the second barrier metal film.
Public/Granted literature
- US20230118368A1 SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-04-20
Information query
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