Invention Grant
- Patent Title: Imaging device and method of manufacturing imaging device
-
Application No.: US17047636Application Date: 2019-02-19
-
Publication No.: US11990489B2Publication Date: 2024-05-21
- Inventor: Shinichiro Noudo , Takuji Matsumoto , Yuji Iseri , Taizo Oishi
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 18089937 2018.05.08
- International Application: PCT/JP2019/005987 2019.02.19
- International Announcement: WO2019/215986A 2019.11.14
- Date entered country: 2020-10-14
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N25/60 ; H04N25/702

Abstract:
A plurality of photoelectric converters is formed on a semiconductor substrate and performs photoelectric conversion according to incident light. A light path portion includes a transparent film through which the incident light is transmitted, a light-blocking wall for each of the plurality of photoelectric converters, the light-blocking wall partitioning the transparent film in a direction perpendicular to the semiconductor substrate, and blocking light, and a light-blocking film at an end of the light-blocking wall, the end being opposite to an end of the light-blocking wall that is closer to the semiconductor substrate, the light-blocking film having a film shape parallel to the semiconductor substrate, and including, for each of the plurality of photoelectric converters, an opening through which the incident light is transmitted. An on-chip lens is arranged for each of the plurality of photoelectric converters, and collects the incident light into the photoelectric converter through the light path portion.
Public/Granted literature
- US20210118930A1 IMAGING DEVICE AND METHOD OF MANUFACTURING IMAGING DEVICE Public/Granted day:2021-04-22
Information query
IPC分类: