Invention Grant
- Patent Title: Semiconductor device and fabricating method thereof
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Application No.: US17234731Application Date: 2021-04-19
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Publication No.: US11990518B2Publication Date: 2024-05-21
- Inventor: Chia-Hua Chang , Jian-Feng Li , Hsiang-Chieh Yen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2110243882.4 2021.03.05
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L21/02 ; H01L21/306 ; H01L29/20 ; H01L29/205 ; H01L29/66 ; H01L29/778

Abstract:
The present disclosure provides a semiconductor device and a fabricating method thereof, the semiconductor device including a substrate, a nucleation layer, a buffer layer, an active layer and a gate electrode. The nucleation layer is disposed on the substrate, and the buffer layer is disposed on the nucleation layer, wherein the buffer layer includes a first superlattice layer having at least two heteromaterials alternately arranged in a horizontal direction, and a second superlattice layer having at least two heteromaterials vertically stacked along a vertical direction. The at least two heteromaterials stack at least once within the second superlattice layer. The active layer is disposed on the buffer layer, and the gate electrode is disposed on the active layer.
Public/Granted literature
- US20220285500A1 Semiconductor Device and Fabricating Method Thereof Public/Granted day:2022-09-08
Information query
IPC分类: