Invention Grant
- Patent Title: Method for applying polymer patches onto a substrate
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Application No.: US17051377Application Date: 2018-09-27
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Publication No.: US11990623B2Publication Date: 2024-05-21
- Inventor: Friedrich Kastner , Franz Grajewski
- Applicant: Collin Lab & Pilot Solutions GmbH
- Applicant Address: DE Maitenbeth
- Assignee: Collin Lab & Pilot Solutions GmbH
- Current Assignee: Collin Lab & Pilot Solutions GmbH
- Current Assignee Address: DE
- Agency: Lerner David LLP
- Priority: EP 001963 2017.11.30
- International Application: PCT/EP2018/000455 2018.09.27
- International Announcement: WO2019/105577A 2019.06.06
- Date entered country: 2020-10-28
- Main IPC: H01M4/60
- IPC: H01M4/60 ; H01M4/04 ; H01M10/052 ; B05C1/08 ; B05C1/16 ; B05D1/26 ; B05D1/28 ; H01M4/139

Abstract:
The invention relates to a method for applying polymer patches, in particular from polymer electrode material, on a carrier substrate, including the following method steps:
a) plasticizing the polymer electrode material to form a melt,
b) feeding the plasticized polymer electrode material via at least one die to a heated, structured roller or to a heated, structured conveyor belt, wherein the roller and/or the conveyor belt have recesses that correspond to the dimensions of the patches to be applied,
c) applying the plasticized polymer electrode material on a carrier substrate by bringing the roller and/or the conveyor belt in contact with a carrier substrate.
a) plasticizing the polymer electrode material to form a melt,
b) feeding the plasticized polymer electrode material via at least one die to a heated, structured roller or to a heated, structured conveyor belt, wherein the roller and/or the conveyor belt have recesses that correspond to the dimensions of the patches to be applied,
c) applying the plasticized polymer electrode material on a carrier substrate by bringing the roller and/or the conveyor belt in contact with a carrier substrate.
Public/Granted literature
- US20210313577A1 Method For Applying Polymer Patches Onto A Substrate Public/Granted day:2021-10-07
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