Invention Grant
- Patent Title: Optical module
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Application No.: US17475775Application Date: 2021-09-15
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Publication No.: US11990725B2Publication Date: 2024-05-21
- Inventor: Dan Li , Mengbo Fu , Qinhao Fu , Yifan Xie , Tengfei Wang
- Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
- Applicant Address: CN Shandong
- Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
- Current Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shandong
- Agency: Morgan, Lewis & Bockius LLP
- Priority: CN 2010442741.0 2020.05.22 CN 2010442745.9 2020.05.22 CN 2020885055.6 2020.05.22 CN 2020885645.9 2020.05.22
- Main IPC: H01S3/04
- IPC: H01S3/04 ; G02B6/42 ; H04B10/50

Abstract:
An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.
Public/Granted literature
- US20220006253A1 OPTICAL MODULE Public/Granted day:2022-01-06
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