Provided is a circuit structure having a novel structure that allows heat from a heat-generating component to be dissipated more efficiently. A circuit structure includes: a heat-generating component that generates heat when energized; energization bus bars that are connected to connection portions of the heat-generating component; cooling members that are formed separately from the energization bus bars, and are connected to the connection portions of the heat-generating component along with energization bus bars, and the heat-transfer portions that are provided in the cooling members, and are in heat-conductive contact with a heat-dissipating body.