Invention Grant
- Patent Title: Microstrip delay matching using printed dielectric material
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Application No.: US17948854Application Date: 2022-09-20
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Publication No.: US11991819B2Publication Date: 2024-05-21
- Inventor: Bhyrav Mutnury , Timothy M. Lambert , Sandor Farkas
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A printed circuit board includes a first and second microstrip circuit traces formed on an outer surface of the printed circuit board, and a patterned dielectric material applied over a first length of the first microstrip circuit trace. The first microstrip circuit trace has a first length and carries a first signal. The second microstrip circuit trace is adjacent to the first microstrip circuit trace, has a second length longer than the first length, and carries a second signal. The patterned dielectric material is provided over a portion of the first length to delay the first signal relative to the second signal.
Public/Granted literature
- US20240098883A1 MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL Public/Granted day:2024-03-21
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