Invention Grant
- Patent Title: Conductive film and manufacturing method thereof
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Application No.: US17333972Application Date: 2021-05-28
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Publication No.: US11991823B2Publication Date: 2024-05-21
- Inventor: Chih-Yi Lin , Kuo-Kuang Cheng , Chi-Chin Chiang , Wen-Hsin Tai , I-Ju Wu , Chi-Ho Tien
- Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Applicant Address: TW Kaohsiung
- Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Current Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
- Current Assignee Address: TW Kaohsiung
- Agency: WPAT, PC
- Priority: TW 9119104 2020.06.05
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B29C48/00 ; C08L75/04 ; C09D11/52 ; B29K75/00

Abstract:
The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.
Public/Granted literature
- US20210385947A1 CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-12-09
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