Invention Grant
- Patent Title: Load vectoring heat sink
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Application No.: US17696127Application Date: 2022-03-16
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Publication No.: US11991864B2Publication Date: 2024-05-21
- Inventor: Ryan Tong
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Lerner David LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A heat sink includes multiple load points and a plurality of load cell for each of the load points. Each of the load cells is configured to attach to a respective attachment point on a component and to create a tensile load between the respective attachment point of the component and a respective one of the load points of the heat sink. At least one of the load cells is configured to produce a different maximum tensile load than another load cell among the plurality of load cells.
Public/Granted literature
- US20230301029A1 Load Vectoring Heat Sink Public/Granted day:2023-09-21
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