Invention Grant
- Patent Title: DRAM circuitry and method of forming DRAM circuitry
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Application No.: US17388184Application Date: 2021-07-29
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Publication No.: US11991877B2Publication Date: 2024-05-21
- Inventor: Toshihiko Miyashita , Dan Mocuta
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L27/092 ; H01L29/08 ; H01L29/167 ; H01L29/423 ; H01L29/51 ; H01L29/66 ; H01L29/78

Abstract:
DRAM circuitry comprises a memory array comprising memory cells individually comprising a transistor and a charge-storage device. The transistors individually comprise two source/drain regions having a gate there-between that is part of one of multiple wordlines of the memory array. One of the source/drain regions is electrically coupled to one of the charge-storage devices. The other of the source/drain regions is electrically coupled to one of multiple sense lines of the memory array. Peripheral circuitry comprises wordline-driver transistors having gates which individually comprise one of the wordlines and comprises sense-line-amplifier transistors having gates which individually comprise one of the sense lines. The sense-line-amplifier transistors and the wordline-driver transistors individually are a finFET having at least one fin comprising a channel region of the respective finFET. The sense-line-amplifier transistors and the wordline-driver transistors individually comprise two source/drain regions that individually comprise conductively-doped epitaxial semiconductor material that is adjacent one of two laterally-opposing sides of the at least one fin in a vertical cross-section. Methods are also disclosed.
Public/Granted literature
- US20230031076A1 DRAM Circuitry And Method Of Forming DRAM Circuitry Public/Granted day:2023-02-02
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