- Patent Title: Solid-state image pickup device and manufacturing method thereof
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Application No.: US17364370Application Date: 2021-06-30
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Publication No.: US11991889B2Publication Date: 2024-05-21
- Inventor: Keisuke Hatano , Tetsuji Yamaguchi , Shintarou Hirata
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 11271195 2011.12.12
- Main IPC: H10K39/32
- IPC: H10K39/32 ; H01L27/146 ; H01L31/12 ; H10K30/00 ; H10K30/81 ; H10K30/82 ; H10K30/87 ; H10K30/88 ; H10K71/00
Abstract:
There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the functional region.
Public/Granted literature
- US20210408124A1 SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-12-30
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