Invention Grant
- Patent Title: Memory devices and methods of forming memory devices
-
Application No.: US17136133Application Date: 2020-12-29
-
Publication No.: US11991938B2Publication Date: 2024-05-21
- Inventor: Desmond Jia Jun Loy , Eng Huat Toh , Shyue Seng Tan
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: VIERING JENTSCHURA & PARTNER MBB
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H10B63/00 ; H10N70/00

Abstract:
A memory device may be provided, including a first electrode, an insulating element arranged over the first electrode, a second electrode arranged over the insulating element, a switching layer and a conductive line electrically coupled to the second electrode. Each of the first electrode, the insulating element, and the second electrode may include a first side surface and a second side surface. Centers of the first electrode, the insulating element, and the second electrode may be substantially vertically aligned. The first side surface and the second side surface of the second electrode may be substantially vertically aligned with the first side surface and the second side surface of at least one of the insulating element and the first electrode. The switching layer may be conformal to the first side surfaces and the second side surfaces of the second electrode and the insulating element.
Public/Granted literature
- US20220209109A1 MEMORY DEVICES AND METHODS OF FORMING MEMORY DEVICES Public/Granted day:2022-06-30
Information query
IPC分类: