Invention Grant
- Patent Title: Machining method of wire discharge machine, machining program generating device, wire discharge machining system and machined object manufacturing method
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Application No.: US17537454Application Date: 2021-11-29
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Publication No.: US11992891B2Publication Date: 2024-05-28
- Inventor: Tsubasa Kuragaya , Masashi Sakaguchi
- Applicant: Sodick Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Sodick Co., Ltd.
- Current Assignee: Sodick Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: JCIPRNET
- Priority: JP 20204071 2020.12.09 JP 21074768 2021.04.27
- Main IPC: B23H7/06
- IPC: B23H7/06 ; B23H7/10 ; B23H7/20

Abstract:
The disclosure provides a machining program generating device of a wire discharge machine, a machining program generating method, a wire discharge machining system and a machined object manufacturing method. The machining method of the wire discharge machine of the disclosure includes: a processing of forming and machining a claw part on at least one of a machining path of a machining groove and a machining path of a dividing line for dividing a core that forms an inner part of a workpiece separated by the machining groove; and a processing of separating the core from the workpiece by dividing at the dividing line.
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