Invention Grant
- Patent Title: Solder and method for producing high purity lead
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Application No.: US17697649Application Date: 2022-03-17
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Publication No.: US11992903B2Publication Date: 2024-05-28
- Inventor: Koen Govaerts , Pelle Lemmens , Kris Mannaerts , Jan Dirk A. Goris , Yves De Visscher , Charles Geenen , Bert Coletti
- Applicant: METALLO BELGIUM
- Applicant Address: BE Beerse
- Assignee: METALLO BELGIUM
- Current Assignee: METALLO BELGIUM
- Current Assignee Address: BE Beerse
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Priority: EP 190907 2016.09.27
- The original application number of the division: US16335892
- Main IPC: B23K35/26
- IPC: B23K35/26 ; B01D3/10 ; C22C11/10

Abstract:
A process for the production of a metal mixture composition containing lead and tin, and comprising by weight at least 10% tin and 45% lead, at least 90% of tin and lead together, more lead than tin, from 1-5000 ppm of copper, at least 0.42% antimony and at least 0.0001% wt of sulphur, at most 0.1% of the total of chromium, manganese, vanadium, titanium and tungsten, and at most 0.1% of each one of aluminium, nickel, iron and zinc. The process includes a pre-treatment step for producing the metal mixture composition, followed by a vacuum distillation step wherein lead is removed by evaporation and a bottom stream is obtained comprising at least 0.6% wt of lead.
Public/Granted literature
- US20220203482A1 SOLDER AND METHOD FOR PRODUCING HIGH PURITY LEAD Public/Granted day:2022-06-30
Information query
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