Invention Grant
- Patent Title: Liquid blow molding device
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Application No.: US17614405Application Date: 2020-04-07
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Publication No.: US11992992B2Publication Date: 2024-05-28
- Inventor: Kei Yoshino , Mitsuru Shiokawa
- Applicant: YOSHINO KOGYOSHO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: YOSHINO KOGYOSHO CO., LTD.
- Current Assignee: YOSHINO KOGYOSHO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 19101668 2019.05.30
- International Application: PCT/JP2020/015708 2020.04.07
- International Announcement: WO2020/241063A 2020.12.03
- Date entered country: 2021-11-26
- Main IPC: B29C49/46
- IPC: B29C49/46 ; B29C49/00 ; B29C49/12 ; B29C49/42 ; B29C49/58 ; B29L31/00

Abstract:
A liquid blow molding apparatus, including: a nozzle configured to define a flow path for a liquid that includes an opening and closing port and a discharge port; a seal body configured to open and close the opening and closing port and includes a guide hole; and a rod configured to move in an axial direction while being guided by the guide hole, wherein the seal body includes a tubular-shaped extension portion configured to extend into the discharge port when the seal body closes the opening and closing port, and a tip surface of the extension portion is configured to have liquid repellency.
Public/Granted literature
- US20220203596A1 LIQUID BLOW MOLDING DEVICE Public/Granted day:2022-06-30
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