Invention Grant
- Patent Title: Self-rising board molding
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Application No.: US17814555Application Date: 2022-07-25
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Publication No.: US11993027B2Publication Date: 2024-05-28
- Inventor: Andrea Piana , Andy Hollis , Mehran Jafari , Helias Andriessen , Sang-hoon Lim , Eric McCann
- Applicant: Piana Nonwovens, LLC.
- Applicant Address: US GA Cartersville
- Assignee: PIANA NONWOVENS, LLC.
- Current Assignee: PIANA NONWOVENS, LLC.
- Current Assignee Address: US GA Cartersville
- Agency: WC&F IP
- Main IPC: B29C70/34
- IPC: B29C70/34 ; B29C70/12 ; B29C70/54 ; B29K267/00 ; B29L31/00

Abstract:
Expandable substrates, which are referred to as blanks, are created by compressing thermobonded nonwovens after heating the binder material above its melting temperature, and then cooling the compressed nonwovens so that the binder material hardens and holds the fibers of the nonwoven together in a compressed configuration with stored kinetic energy. A mold for the component to be manufactured can be partially filled with a number of boards (or blanks) in a stacked, vertically, adjacent or even random orientation. Upon application of heat to the boards or blanks or parts in the mold, the binder material is melted so as to allow the nonwoven material to expand in one or more directions, and thereby fill all or part of the mold. Upon cooling, the binder material again hardens, and the molded component is retrieved from the mold.
Public/Granted literature
- US20220363018A1 SELF-RISING BOARD MOLDING Public/Granted day:2022-11-17
Information query
IPC分类: