Invention Grant
- Patent Title: Chuck, lamination process, and manufacturing method of semiconductor package using the same
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Application No.: US17395440Application Date: 2021-08-05
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Publication No.: US11993066B2Publication Date: 2024-05-28
- Inventor: Wei-Jie Huang , Yu-Ching Lo , Ching-Pin Yuan , Wen-Chih Lin , Cheng-Yu Kuo , Yi-Yang Lei , Ching-Hua Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L21/48
- IPC: H01L21/48 ; B32B38/18 ; H01L23/00
Abstract:
A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.
Public/Granted literature
- US20220314595A1 CHUCK, LAMINATION PROCESS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2022-10-06
Information query
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