- Patent Title: Carbon hard mask, film forming apparatus, and film forming method
-
Application No.: US17415104Application Date: 2019-12-04
-
Publication No.: US11993849B2Publication Date: 2024-05-28
- Inventor: Masaru Hori , Makoto Sekine , Hirotsugu Sugiura , Tsuyoshi Moriya , Satoshi Tanaka , Yoshinori Morisada
- Applicant: Tokyo Electron Limited , National University Corporation Tokai National Higher Education and Research System
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED,National University Corporation Tokai National Higher Education and Research System
- Current Assignee: TOKYO ELECTRON LIMITED,National University Corporation Tokai National Higher Education and Research System
- Current Assignee Address: JP Tokyo; JP Aichi
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 18236009 2018.12.18
- International Application: PCT/JP2019/047328 2019.12.04
- International Announcement: WO2020/129628A 2020.06.25
- Date entered country: 2021-06-17
- Main IPC: C23C16/52
- IPC: C23C16/52 ; C23C16/26 ; H01J37/32 ; H01L21/033
Abstract:
According to one embodiment, there is provided a carbon hard mask laminated on an etching target film, in which the concentration ratio of a methylene group CH2 and a methyl group CH3 contained in the carbon hard mask satisfies the expression CH2/(CH2+CH3)≥0.5.
Information query
IPC分类:
