Invention Grant
- Patent Title: SRAM structure with asymmetric interconnection
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Application No.: US18062172Application Date: 2022-12-06
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Publication No.: US11996140B2Publication Date: 2024-05-28
- Inventor: Yi-Hsun Chiu , Chia-En Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: G11C11/412
- IPC: G11C11/412 ; G11C11/417 ; H10B10/00

Abstract:
A semiconductor structure includes a substrate having a frontside and a backside; a static random-access memory (SRAM) circuit having SRAM bit cells formed on the frontside of the substrate, wherein each of the SRAM bit cells including two inverters cross-coupled together, and a first and second pass gates coupled to the two inverters; a first bit-line disposed on the frontside of the substrate and connected to the first pass gate; and a second bit-line disposed on the backside of the substrate and connected to the second pass gate.
Public/Granted literature
- US20230102877A1 SRAM Structure with Asymmetric Interconnection Public/Granted day:2023-03-30
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