Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US18180140Application Date: 2023-03-08
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Publication No.: US11996332B2Publication Date: 2024-05-28
- Inventor: Kuan-Ting Pan , Chih-Hao Wang , Kuo-Cheng Chiang , Yi-Bo Liao , Yi-Ruei Jhan
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- The original application number of the division: US16856033 2020.04.23
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/762 ; H01L29/423

Abstract:
A semiconductor device includes a semiconductor substrate, a first semiconductor stack, a second semiconductor stack, a first gate structure, and a second gate structure. The semiconductor substrate comprising a first device region and a second device region. The first semiconductor stack is located on the semiconductor substrate over the first device region, and has first channels. The second semiconductor stack is located on the semiconductor substrate over the second device region, and has second channels. A total number of the first channels is greater than a total number of the second channels. The first gate structure encloses the first semiconductor stack. The second gate structure encloses the second semiconductor stack.
Public/Granted literature
- US20230223305A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-07-13
Information query
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