Invention Grant
- Patent Title: Intelligent integrated assembly and transfer apparatus for semiconductor light emitting device
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Application No.: US17013201Application Date: 2020-09-04
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Publication No.: US11996393B2Publication Date: 2024-05-28
- Inventor: Bongchu Shim , Hyunwoo Cho
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR 20200057811 2020.05.14
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L21/67 ; H01L33/00

Abstract:
The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber 300, a roller unit 200 and assembly inspection unit 500. The fluid chamber 300 can accommodate semiconductor light emitting devices 150. Semiconductor light emitting devices 150 can be assembled on an assembly substrate 210. The assembly substrate 210 can be mounted on the roller unit 200. The roller unit 200 can rotate the assembly substrate 210. The assembly inspection unit 500 can inspect the semiconductor light emitting devices 150 assembled on the assembly substrate 210. The roller unit 200 can include a roller rotated part 220 where the assembly substrate 210 is mounted and rotated, a roller driving part 230 for rotating the roller rotated part 220, and a magnet head unit 400 for applying magnetic force to the semiconductor light emitting devices 150 to be assembled on the assembly substrate 210.
Public/Granted literature
- US20210358893A1 INTELLIGENT INTEGRATED ASSEMBLY AND TRANSFER APPARATUS FOR SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2021-11-18
Information query
IPC分类: