Invention Grant
- Patent Title: CMOS image sensor structure with microstructures on backside surface of semiconductor layer
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Application No.: US17525926Application Date: 2021-11-14
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Publication No.: US11996429B2Publication Date: 2024-05-28
- Inventor: Chien-Nan Tu , Yu-Lung Yeh , Hsing-Chih Lin , Chien-Chang Huang , Shih-Shiung Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- The original application number of the division: US15796693 2017.10.27
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A semiconductor device includes a device layer, a semiconductor layer, a sensor element, a dielectric layer, a color filter layer, and a micro-lens. The semiconductor layer is over the device layer. The semiconductor layer has a plurality of microstructures thereon. Each of the microstructures has a substantially triangular cross-section. The sensor element is under the microstructures of the semiconductor layer and is configured to sense incident light. The dielectric layer is over the microstructures of the semiconductor layer. The color filter layer is over the dielectric layer. The micro-lens is over the color filter layer.
Public/Granted literature
- US20220077214A1 CMOS IMAGE SENSOR STRUCTURE Public/Granted day:2022-03-10
Information query
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