Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17568421Application Date: 2022-01-04
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Publication No.: US11996475B2Publication Date: 2024-05-28
- Inventor: Masakazu Baba , Shinsuke Harada
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JP 21000963 2021.01.06
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/16 ; H01L29/417 ; H01L29/423 ; H01L29/47 ; H01L29/49

Abstract:
One object is to provide a semiconductor device capable of reducing loss during turn-on and degradation of forward voltage. A vertical MOSFET includes a semiconductor substrate 2 of a first conductivity type, a first semiconductor layer 1 of the first conductivity type, a second semiconductor layer 16 of a second conductivity type, first semiconductor regions 17 of the first conductivity type, first trenches 31 and a second trench 32, gate electrodes 20 provided in the first trenches 31 via a gate insulating film 19, and a Schottky electrode 29 provided in the second trench 32. The first trenches 31 are provided in a striped pattern, in a plan view and the second trench 32 surrounds the first trenches 31.
Public/Granted literature
- US20220216334A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-07-07
Information query
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