Invention Grant
- Patent Title: Fuse structure
-
Application No.: US17407402Application Date: 2021-08-20
-
Publication No.: US11996837B2Publication Date: 2024-05-28
- Inventor: Tun Jen Chang , Tung-Heng Hsieh , Bao-Ru Young
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H03K17/687
- IPC: H03K17/687 ; H01L23/525 ; H01L27/088 ; H01L29/423

Abstract:
A fuse structure includes first and second transistors where each of the first and the second transistors has a source terminal, a drain terminal, and a gate terminal; a first source/drain contact disposed on the source terminal of the first transistor; a second source/drain contact disposed on the drain terminal of the second transistor; an insulator disposed laterally between the first and the second source/drain contacts; a source/drain contact via disposed on the first source/drain contact; and a program line connected to the source/drain contact via, wherein a width of the insulator is configured such that a programming potential applied across the source/drain contact via and the drain terminal of the second transistor causes the insulator to break down.
Public/Granted literature
- US20230055943A1 Fuse Structure Public/Granted day:2023-02-23
Information query
IPC分类: