An open-ear headphone with an acoustic module that is configured to be located at least in part in a concha of an outer ear of a user. The acoustic module includes an acoustic transducer, and a sound-emitting opening that is configured to emit sound produced by the acoustic transducer. A battery housing is configured to be located behind the outer ear and contains a battery power source. A compliant connecting portion couples the battery housing to the acoustic module. The connecting position enables displacement of the battery housing relative to the acoustic module.