Invention Grant
- Patent Title: Redistribution plate
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Application No.: US17971821Application Date: 2022-10-24
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Publication No.: US11997789B2Publication Date: 2024-05-28
- Inventor: Dominik Schmidt , Prasanna Rao Chitturi , Jed Hsu
- Applicant: Translarity, Inc.
- Applicant Address: US CA Fremont
- Assignee: Translarity, Inc.
- Current Assignee: Translarity, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Shapiro IP Law
- Agent Joseph Shapiro
- Main IPC: H05K1/11
- IPC: H05K1/11 ; G01R1/04 ; H05K1/02 ; H05K3/00 ; H05K3/04 ; H05K3/42 ; H05K3/24 ; H05K3/36

Abstract:
A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.
Public/Granted literature
- US20230054628A1 REDISTRIBUTION PLATE Public/Granted day:2023-02-23
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