Invention Grant
- Patent Title: Printed circuit board
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Application No.: US17741388Application Date: 2022-05-10
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Publication No.: US11997801B2Publication Date: 2024-05-28
- Inventor: Woo Seok Yang , Jae Han Park , Jung Hyun Cho
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210179530 2021.12.15
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/11 ; H05K1/18

Abstract:
A printed circuit board includes: a core portion including a cavity in one surface thereof; first and second penetration holes disposed in a bottom surface of the cavity and penetrating through the core portion; an electronic component disposed in the cavity; and an insulating material filling the cavity and each of the first and second penetration holes, wherein a sidewall of the cavity is higher than the electronic component.
Public/Granted literature
- US20230189452A1 PRINTED CIRCUIT BOARD Public/Granted day:2023-06-15
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