Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
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Application No.: US17266597Application Date: 2020-09-08
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Publication No.: US11997878B2Publication Date: 2024-05-28
- Inventor: Huihui Zhao , Changbum Park
- Applicant: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Hubei
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Hubei
- Agency: PV IP PC
- Agent Wei Te Chung; Zhigang Ma
- Priority: CN 2010706047.5 2020.07.21
- International Application: PCT/CN2020/113893 2020.09.08
- International Announcement: WO2022/016679A 2022.01.27
- Date entered country: 2021-02-07
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H10K59/121

Abstract:
An array substrate and a manufacturing method thereof are provided. The array substrate includes a substrate and a first recess. The first recess sequentially extends through a second dielectric layer, a third insulating layer, a first dielectric layer, a second insulating layer, a first insulating layer, an active layer, and a portion of a barrier layer. A bottom surface of the first recess is formed inside the barrier layer.
Public/Granted literature
- US20220310730A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-09-29
Information query
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