- Patent Title: Thermal conductive layer for transducer face temperature reduction
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Application No.: US18166645Application Date: 2023-02-09
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Publication No.: US11998397B2Publication Date: 2024-06-04
- Inventor: Wei Li , Keith Williams
- Applicant: FUJIFILM SONOSITE, INC.
- Applicant Address: US WA Bothell
- Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee: FUJIFILM SONOSITE, INC.
- Current Assignee Address: US WA Bothell
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: A61B8/00
- IPC: A61B8/00 ; B06B1/06

Abstract:
A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.
Public/Granted literature
- US20230181167A1 THERMAL CONDUCTIVE LAYER FOR TRANSDUCER FACE TEMPERATURE REDUCTION Public/Granted day:2023-06-15
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