Invention Grant
- Patent Title: Increased MUT coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries
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Application No.: US17018304Application Date: 2020-09-11
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Publication No.: US11998950B2Publication Date: 2024-06-04
- Inventor: Brian Bircumshaw , Sandeep Akkaraju , Haesung Kwon
- Applicant: eXo Imaging, Inc.
- Applicant Address: US CA Redwood City
- Assignee: Exo Imaging, Inc.
- Current Assignee: Exo Imaging, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: B06B1/06
- IPC: B06B1/06 ; H10N30/50 ; H10N30/87 ; H10N30/00
Abstract:
Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.
Public/Granted literature
- US20210078042A1 INCREASED MUT COUPLING EFFICIENCY AND BANDWIDTH VIA EDGE GROOVE, VIRTUAL PIVOTS, AND FREE BOUNDARIES Public/Granted day:2021-03-18
Information query
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