- Patent Title: Shrink ring for extrusion die, and extrusion die comprising same
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Application No.: US17862550Application Date: 2022-07-12
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Publication No.: US11998965B2Publication Date: 2024-06-04
- Inventor: Iouri Zlotnikov , Christopher Braun , Russell Peterson , Robert Sulisz , Jason Krause
- Applicant: Exco Technologies Limited
- Applicant Address: CA Markham
- Assignee: Exco Technologies Limited
- Current Assignee: Exco Technologies Limited
- Current Assignee Address: CA Markham
- Main IPC: B21C25/02
- IPC: B21C25/02 ; B21C25/04
Abstract:
An extrusion die includes: a cylindrical mandrel, the mandrel having a circumferential groove formed therein; a cylindrical die plate, the mandrel and the die plate being coupled together; and a shrink ring disposed in the circumferential groove of the mandrel.
Public/Granted literature
- US20240017313A1 SHRINK RING FOR EXTRUSION DIE, AND EXTRUSION DIE COMPRISING SAME Public/Granted day:2024-01-18
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