Invention Grant
- Patent Title: Method and device for conducting and monitoring a machining process of a workpiece
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Application No.: US17162782Application Date: 2021-01-29
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Publication No.: US11999017B2Publication Date: 2024-06-04
- Inventor: Eckhard Lessmueller , Christian Truckenbrodt , Maximilian Schmidt
- Applicant: Lessmüller Lasertechnik GmbH
- Applicant Address: DE Munich
- Assignee: Lessmüller Lasertechnik GmbH
- Current Assignee: Lessmüller Lasertechnik GmbH
- Current Assignee Address: DE Munich
- Agency: Bradley Arant Boult Cummings LLP
- Agent Henry B. Ward, III
- Priority: DE 2020000630.2 2020.01.30
- Main IPC: B23K26/70
- IPC: B23K26/70 ; B23K26/06 ; B23K26/28

Abstract:
The invention relates to a method for conducting and monitoring a machining process of a workpiece (10), in particular a welding process for joining the workpiece (10) to a further workpiece (10), by means of a high-energy machining beam (14), wherein the method comprises the following steps: generating a high-energy machining beam (14); projecting and/or focusing the machining beam (14) onto the workpiece (10), wherein, in accordance with a machining control signal, different machining regions of the workpiece (10) are machined; generating a measurement beam (16) by means of an optical coherence tomograph (18), wherein the measurement beam (16) is able to be coupled into the machining beam (14); determining measurement points (20) during the machining process by means of the optical coherence tomograph (18) using the measurement beam (16), in accordance with a measurement control signal; obtaining at least one external signal which is based on a measured variable and which is independent of a processing of the machining control signal and of the measurement control signal; generating an evaluation on the basis of the measurement points (20) and of the at least one external signal, which evaluation comprises a comparison of the measurement points (20) with at least one threshold value; monitoring the machining process on the basis of the evaluation.
The invention relates further to a correspondingly configured device for conducting and monitoring a machining process of a workpiece (10).
The invention relates further to a correspondingly configured device for conducting and monitoring a machining process of a workpiece (10).
Public/Granted literature
- US20210237208A1 METHOD AND DEVICE FOR CONDUCTING AND MONITORING A MACHINING PROCESS OF A WORKPIECE Public/Granted day:2021-08-05
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