Invention Grant
- Patent Title: Electromechanical microsystem
-
Application No.: US17828091Application Date: 2022-05-31
-
Publication No.: US11999613B2Publication Date: 2024-06-04
- Inventor: Laurent Mollard , Stéphane Nicolas , Damien Saint-Patrice
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR 05643 2021.05.31
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00

Abstract:
An electromechanical microsystem including an electromechanical transducer, a deformable diaphragm and a cavity hermetically containing a deformable medium keeping a constant volume under the action of an external pressure change. The deformable diaphragm forms a wall of the cavity and has at least one free area so as to be elastically deformed. The electromechanical transducer is configured so that its movement depends on the change in the external pressure, and vice versa. The free area cooperates with an external member so that its deformation induces, or is induced by, a movement of the external member. Thus, the electromechanical microsystem is adapted to displace the external member or to detect a movement of this member, the electromechanical microsystem includes at least one pin, configured to bear on a peripheral portion of the free area so that a deformation of the free rea causes an inclination of the pin.
Public/Granted literature
- US20220380205A1 ELECTROMECHANICAL MICROSYSTEM Public/Granted day:2022-12-01
Information query