Invention Grant
- Patent Title: Dielectric thin film, capacitor element, and electronic circuit board
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Application No.: US17269698Application Date: 2019-08-27
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Publication No.: US11999616B2Publication Date: 2024-06-04
- Inventor: Kumiko Yamazaki , Wakiko Sato , Junichi Yamazaki
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 18163799 2018.08.31
- International Application: PCT/JP2019/033545 2019.08.27
- International Announcement: WO2020/045447A 2020.03.05
- Date entered country: 2021-02-19
- Main IPC: C01B21/082
- IPC: C01B21/082 ; C01G35/00 ; C23C14/06 ; H01G4/12 ; H01G4/30 ; H01G4/33 ; H01L49/02 ; H05K1/16
Abstract:
A capacitive element and a dielectric thin film having a small dielectric loss and a large relative permittivity, particularly at low frequencies. [Solution] This dielectric thin film includes an A-B—O—N oxynitride. When the A-B—O—N oxynitride is represented by the compositional formula AaBbOoNn, (o+n)/a
Public/Granted literature
- US20210238037A1 DIELECTRIC THIN FILM, CAPACITOR ELEMENT, AND ELECTRONIC CIRCUIT BOARD Public/Granted day:2021-08-05
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