A polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties, and excellent mechanical properties. The polymerizable mixture can be used in a method for forming copolymers and the copolymers can be used in an electronic device as dielectric material. The copolymers can also be used in a manufacturing method for preparing a packaged microelectronic structure and microelectronic devices comprising the packaged microelectronic structure.