Invention Grant
- Patent Title: Sonde with integral pressure sensor and method
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Application No.: US18117967Application Date: 2023-03-06
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Publication No.: US12000265B2Publication Date: 2024-06-04
- Inventor: Albert W. Chau , Dmitry Feldman , Benjamin John Medeiros
- Applicant: Merlin Technology, Inc.
- Applicant Address: US WA Kent
- Assignee: Merlin Technology, Inc.
- Current Assignee: Merlin Technology, Inc.
- Current Assignee Address: US WA Kent
- Agency: Pritzkau Patent Group LLC
- Main IPC: E21B47/01
- IPC: E21B47/01 ; E21B47/06 ; E21B47/017

Abstract:
Generally, a sonde, associated components and methods are described which can be used in conjunction with an inground tool having an inground tool housing that defines an inground tool cavity such that the inground tool cavity is exposed to an ambient pressure environment which surrounds the inground tool during an inground operation. A sonde housing assembly includes an exterior configuration that is receivable within the inground tool cavity. The sonde housing assembly at least partially defines a sonde interior and is further configured for receiving the pressure sensor body of a pressure sensor in a pressure sealed engagement. A sonde electronics package is supported within the sonde interior and is at least configured to receive the pressure signal and transfer a corresponding pressure signal from the sonde.
Public/Granted literature
- US20230203939A1 SONDE WITH INTEGRAL PRESSURE SENSOR AND METHOD Public/Granted day:2023-06-29
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