Invention Grant
- Patent Title: Systems and methods for reducing vibration of apparatuses
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Application No.: US17691805Application Date: 2022-03-10
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Publication No.: US12000455B2Publication Date: 2024-06-04
- Inventor: Yi Chen Ho , Chih Ping Liao , Chien Ting Lin , Jie-Ying Yang , Wei-Ming Wang , Ker-Hsun Liao , Chi-Hsun Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT PC
- Main IPC: F16F7/10
- IPC: F16F7/10 ; B23Q11/00
Abstract:
A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.
Public/Granted literature
- US20230287952A1 SYSTEMS AND METHODS FOR REDUCING VIBRATION OF APPARATUSES Public/Granted day:2023-09-14
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