Invention Grant
- Patent Title: Heat exchanger
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Application No.: US17419211Application Date: 2019-10-14
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Publication No.: US12000657B2Publication Date: 2024-06-04
- Inventor: Kang Tae Seo , Young In Son
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20180172420 2018.12.28
- International Application: PCT/KR2019/013435 2019.10.14
- International Announcement: WO2020/138666A 2020.07.02
- Date entered country: 2021-06-28
- Main IPC: F28D1/053
- IPC: F28D1/053 ; F28F9/02

Abstract:
A heat exchanger according to a concept of the disclosure includes an inlet pipe, an outlet pipe, and a connecting pipe connecting a first header to a second header, to perform heat exchange while a refrigerant flows in one direction of a up direction or a down direction in the heat exchanger to thereby improve circulation of the refrigerant, wherein each of the first header and the second header includes a plurality of partitioned chambers therein to distribute the refrigerant several times according to a flow of the refrigerant passing through each chamber, thereby improving distribution and mixing of the refrigerant.
Public/Granted literature
- US20220065543A1 HEAT EXCHANGER Public/Granted day:2022-03-03
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