Invention Grant
- Patent Title: Sensor module having conductive bonding members with varying melting points and young's moduli
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Application No.: US17677234Application Date: 2022-02-22
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Publication No.: US12000857B2Publication Date: 2024-06-04
- Inventor: Masayasu Sakuma
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP 21028264 2021.02.25
- Main IPC: G01P15/08
- IPC: G01P15/08 ; B81B7/00 ; G01P1/02 ; G01P3/00 ; G01P15/18
Abstract:
A sensor module includes: a substrate including a first terminal and a second terminal; a first conductive bonding member having a first melting point and a first Young's modulus; a lead bonded to the first terminal by the first conductive bonding member; a second conductive bonding member having a second melting point lower than the first melting point and a second Young's modulus higher than the first Young's modulus; and an inertial sensor bonded to the second terminal by the second conductive bonding member.
Public/Granted literature
- US20220268806A1 SENSOR MODULE Public/Granted day:2022-08-25
Information query
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