An electrical connecting device includes probes, and a probe head including a middle guide plate arranged between a top guide plate and a bottom guide plate and closer to the bottom guide plate so as to lead the probes to penetrate therethrough. The top guide plate and the middle guide plate are provided with guide holes through which the probes are inserted at positions shifted between the top guide plate and the middle guide plate so as to lead the probes to be held in a bent state between the top guide plate and the middle guide plate. The probes have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes buckled when tip end parts of the probes are brought into contact with an inspection object.