Invention Grant
- Patent Title: Lithography exposure system with debris removing mechanism
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Application No.: US17884392Application Date: 2022-08-09
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Publication No.: US12001143B2Publication Date: 2024-06-04
- Inventor: Hung-Jung Hsu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- The original application number of the division: US16810020 2020.03.05
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G02B5/08 ; G03F7/00 ; H01L21/027

Abstract:
A lithography system includes an extreme ultraviolet (EUV) light source, a reticle stage, a reflection layer, and a plurality of light permeable protrusions. The EUV light source is configured for generating an EUV light beam. The reticle stage is configured for holding a reticle with a front surface of the reticle facing in a downward direction. The reflection layer is below the reticle stage. The light permeable protrusions are formed on the reflection layer. Each of the light permeable protrusions includes a bouncing surface facing in a direction that forms an acute angle with the downward direction. A first portion of the EUV light beam from the EUV light source passes through the bouncing surface of each of the light permeable protrusions to the reflection layer and is reflected to the reticle by the reflection layer.
Public/Granted literature
- US20220382162A1 LITHOGRAPHY EXPOSURE SYSTEM WITH DEBRIS REMOVING MECHANISM Public/Granted day:2022-12-01
Information query
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