Invention Grant
- Patent Title: Interconnect system
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Application No.: US17523049Application Date: 2021-11-10
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Publication No.: US12001375B2Publication Date: 2024-06-04
- Inventor: Weilin Wang , Xiaoliang Kang , Xuemin Zhang , Chen Chen , Yang Shi
- Applicant: Shanghai Zhaoxin Semiconductor Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Current Assignee: SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: McClure, Qualey & Rodack, LLP
- Priority: CN 2111141627.5 2021.09.28 CN 2111142578.7 2021.09.28 CN 2111142579.1 2021.09.28 CN 2111142604.6 2021.09.28
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F1/3234 ; G06F9/4401 ; G06F9/48 ; G06F13/16 ; G06F13/40 ; G06F15/78 ; H04L1/00 ; H04L45/00 ; H04L45/02 ; H04L45/42 ; H04L45/745 ; H04L69/324

Abstract:
A interconnect system, including a plurality of sockets and a first interconnect interface. Any two of the sockets are accessible to each other's hardware resources by transmitting a first packet and a second packet through the first interconnect interface. The first packet includes first interconnect information, used for establishing communication between the two sockets. The second packet includes a first data payload, loaded from one of the two sockets. The sockets include a first socket and a second socket, configured to be interconnected with each other through the first interconnect interface.
Public/Granted literature
- US20230101918A1 INTERCONNECT SYSTEM Public/Granted day:2023-03-30
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