Invention Grant
- Patent Title: Memory system and SoC including linear address remapping logic
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Application No.: US18105967Application Date: 2023-02-06
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Publication No.: US12001698B2Publication Date: 2024-06-04
- Inventor: Dongsik Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR 20120065624 2012.06.19
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F12/02 ; G06F12/06 ; G06F15/78 ; G06F13/42

Abstract:
A system-on-chip is connected to a first memory device and a second memory device. The system-on-chip comprises a memory controller configured to control an interleaving access operation on the first and second memory devices. A modem processor is configured to provide an address for accessing the first or second memory devices. A linear address remapping logic is configured to remap an address received from the modem processor and to provide the remapped address to the memory controller. The memory controller performs a linear access operation on the first or second memory device in response to receiving the remapped address.
Public/Granted literature
- US20230185466A1 MEMORY SYSTEM AND SOC INCLUDING LINEAR ADDRESS REMAPPING LOGIC Public/Granted day:2023-06-15
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