Invention Grant
- Patent Title: Suspension damping
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Application No.: US17158955Application Date: 2021-01-26
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Publication No.: US12002497B2Publication Date: 2024-06-04
- Inventor: Ekaratch Pankaew , Kuen Chee Ee , Preecha Sudachun , David Glaess , Chanatkarn Angsutanasombat
- Applicant: Magnecomp Corporation
- Applicant Address: US CA Murrieta
- Assignee: Magnecomp Corporation
- Current Assignee: Magnecomp Corporation
- Current Assignee Address: US CA Murrieta
- Agency: DLA Piper LLP (US)
- Main IPC: G11B5/48
- IPC: G11B5/48

Abstract:
A dielectric layer configured to overlay a spring metal layer in a suspension assembly is described. The dielectric layer includes a tongue portion including a proximate end and a distal end, trace portions extending from the tongue portion, and an aperture aligned with the void and defined by the tongue portion. The aperture includes an elongated opening with opposing ends partially aligning with the central opening of the void. The aperture further includes slits extending from the opposing ends of the elongated opening and at least partially aligned with slits of the void in the spring metal layer.
Public/Granted literature
- US20210241791A1 Suspension Damping Public/Granted day:2021-08-05
Information query
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