Invention Grant
- Patent Title: Fabrication methods for electronic devices integrating magnetic nanostructures
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Application No.: US17176506Application Date: 2021-02-16
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Publication No.: US12002605B1Publication Date: 2024-06-04
- Inventor: Yuepeng Zhang , John N. Hryn , Yunsong Xie
- Applicant: UCHICAGO ARGONNE, LLC
- Applicant Address: US IL Chicago
- Assignee: UCHICAGO ARGONNE, LLC
- Current Assignee: UCHICAGO ARGONNE, LLC
- Current Assignee Address: US IL Chicago
- Agency: MARSHALL, GERSTEIN & BORUN LLP
- Main IPC: H01F41/30
- IPC: H01F41/30 ; C25D1/00 ; H01F1/00 ; H01F1/14 ; H01F41/02 ; B82Y25/00 ; B82Y40/00

Abstract:
Magnetic nanowire components may be used in passive radio-frequency device allowing for smaller size devices, lower power consumption, and on-chip packaging potential across a wide range of technologies. A method for fabricating magnetic nanowire component electronic devices include depositing a conductive device pattern and transmission lines onto a substrate, aligning and securing a magnetic nanowire component to the device pattern, packaging the device with an insulation layer. Alternatively, the conductive device pattern and transmission lines may be deposited on the magnetic nanowire component, and the magnetic nanowire component may then be attached to a substrate.
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