- Patent Title: Multi-layer ceramic electronic component, multi-layer ceramic electronic component mounting substrate, multi-layer ceramic electronic component package, and method of producing a multi-layer ceramic electronic component
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Application No.: US17452046Application Date: 2021-10-22
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Publication No.: US12002626B2Publication Date: 2024-06-04
- Inventor: Hiroaki Sato
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: SALIWANCHIK, LLOYD & EISENSCHENK
- Priority: JP 18156573 2018.08.23
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/12 ; H01G4/248 ; H01G4/30 ; H05K1/18

Abstract:
A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated in a first direction, a first main surface including a first flat region facing in the first direction, and a second main surface including a second flat region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first and second directions, the first flat region being formed at a center portion of the first main surface in the second direction, the second flat region being formed at a center portion of the second main surface in the third direction.
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