Invention Grant
- Patent Title: Multilayer electronic component and method of manufacturing the same
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Application No.: US17749709Application Date: 2022-05-20
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Publication No.: US12002627B2Publication Date: 2024-06-04
- Inventor: Tae Gyeom Lee , Gi Long Kim , Seon Jae Mun , Byung Rok Ahn , Kyoung Jin Cha
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210190625 2021.12.29
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/224

Abstract:
A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.
Public/Granted literature
- US20230207209A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-06-29
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