Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US17856452Application Date: 2022-07-01
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Publication No.: US12002629B2Publication Date: 2024-06-04
- Inventor: Chae Min Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20220010154 2022.01.24
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/12 ; H01G4/224 ; H01G4/232

Abstract:
A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and sealing portions disposed on outer surfaces of the body, wherein the external electrodes and the sealing portions include glass, the sealing portions include first sealing portions that are disposed between the body and the external electrodes, and second sealing portions that extend from the first sealing portions in the second direction and are not in contact with the external electrodes, and an average length of the second sealing portion is 20 μm or more.
Public/Granted literature
- US20230238184A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2023-07-27
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