Invention Grant
- Patent Title: Ceramic printed fuse fabrication
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Application No.: US17538438Application Date: 2021-11-30
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Publication No.: US12002643B2Publication Date: 2024-06-04
- Inventor: Venkat raman Thenkarai Narayanan , Miroslav Horky , Robert Stephen Douglass , John Trublowski
- Applicant: EATON INTELLIGENT POWER LIMITED
- Applicant Address: IE Dublin
- Assignee: Eaton Intelligent Power Limited
- Current Assignee: Eaton Intelligent Power Limited
- Current Assignee Address: IE Dublin
- Agency: Baker Botts L.L.P.
- Main IPC: H01H85/046
- IPC: H01H85/046 ; H01H69/02 ; H01H85/042 ; H01H85/38
Abstract:
A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.
Public/Granted literature
- US20230170174A1 CERAMIC PRINTED FUSE FABRICATION Public/Granted day:2023-06-01
Information query
IPC分类:
