Invention Grant
- Patent Title: Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool
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Application No.: US17359348Application Date: 2021-06-25
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Publication No.: US12002668B2Publication Date: 2024-06-04
- Inventor: Srinivasa Rao Yedla , Kirankumar Neelasandra Savandaiah , Thomas Brezoczky , Hari Prasath Rajendran
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan LLP
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/35 ; C23C14/54

Abstract:
Aspects of the disclosure provided herein generally provide a substrate processing system that includes: a processing chamber including: a top plate having an array of process station openings disposed therethrough surrounding a central axis, a bottom plate having a first central opening, and a plurality of side walls between the top plate and the bottom plate; a plurality of heaters disposed in the top plate and the bottom plate and configured in a plurality of regions; and a system controller configured to independently control the plurality of heaters in each region.
Public/Granted literature
- US20220415635A1 THERMAL MANAGEMENT HARDWARE FOR UNIFORM TEMPERATURE CONTROL FOR ENHANCED BAKE-OUT FOR CLUSTER TOOL Public/Granted day:2022-12-29
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